Intel Thermal Solution Cooling Fan/Heatsink for LGA2011 E5-2600 Processors (BXSTS200C)

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Feature

Pedestal chassis that provides adequate ventilation and correct temperature air to heat sink with fan removed
2U or larger rack chassis with ducted airflow to heat sink
Pedestal chassis with ducted airflow to heat sink
Max CPU TDP 130W
Compatible Socket: LGA2011

Description

Intel active boxed combo solution for 2-socket servers/workstations using e5-26xx & e5-16xx processors