Sizzix 660513 Accessory Die Brush and Foam Pad for Wafer-Thin Dies, None

Feature

Size die brush removes excess paper easily and ergonomically
Sleek, ergonomic rubber-grip handle for non-slippage and easy manoeuvrability
Includes a foam pad that acts as the perfect work surface for removing excess paper from the dies and the cut-out

Description

When it comes to removing excess paper in all brands of wafer-thin, chemically-etched dies, the Size die brush does it easily and ergonomically. With a sleek, ergonomic rubber-grip handle for non-slippage and easy manoeuvrability, the die brush easily rolls away excess paper to reveal the perfect cut! the die brush includes a foam pad that acts as the perfect work surface for removing excess paper from the dies and even the cut-out.